Behind the MFG. Ep.2.2 | Developing the Formic Acid Reflow Process

在先進封裝與高可靠度電子製造中，「看不見的殘留與風險」往往是良率的最大挑戰。本集邀請 CW 分享 USI COD 如何開發業界首創的無松香 SMT 甲酸迴流焊製程，從源頭避免殘留產生，省去後清洗流程；同時透過黑色 Flux 讓貼片機能即時辨識浸漬狀態，將隱形風險轉化為可視化防錯。從零殘留到主動攔截缺陷，這就是製程創新的真正價值。 In advanced packaging and high-reliability electronics, invisible residue and hidden process risks can become major threats to yield. In this episode of Driving Force Behind the MFG., CW reveals how USI’s COD team developed an industry-first rosin-free SMT Formic Acid Reflow process, using formic acid gas to replace conventional rosin flux and achieve truly residue-free soldering. The team also introduced Black Flux for visual management, enabling placement machines to detect flux dipping conditions in real time and prevent open-solder defects before they reach downstream processes. From eliminating post-cleaning to making invisible risks visible, this episode shows how USI transforms process challenges into proactive mistake-proofing, energy-saving manufacturing, and stronger product reliability for customers. USI Blog 延伸閱讀 / Learn More 【From "Manufacturing" to "Creation" Ep.2: Innovation Built from Zero to One】 https://www.usiglobal.com/en/blog/beh... ➥ Get to know more about USI https://www.usiglobal.com/en/vision-m... ➥ Look out for our Services & Solutions https://www.usiglobal.com/en/blogs ➥ Join USI https://www.usiglobal.com/en/join ➥ For any queries, please contact us in Email ⬇︎⬇︎⬇︎ pr@usiglobal.com #usi #FormicAcidReflow #smt #advancedpackaging #ProcessInnovation