PIB-CVD Advances Thin Film Deposition for Quantum Device Manufacturing

Quantum device manufacturing requires dense, ultra-pure thin films that can conformally coat complex, high-aspect-ratio structures such as Through-Silicon Vias (TSVs). In our video, Denton researcher Ravindranath Viswan, PhD, discusses using PIB-CVD and HiPIMS to deposit advanced materials for quantum devices, including how adjusting deposition conditions can be used to tailor film properties such as crystallinity, composition, density, and electrical performance. Learn more about Denton Vacuum: https://www.dentonvacuum.com/