APECS Pilot Line: How Companies Access Advanced Packaging in Europe

In this video, Luis Fonseca from the Institute of Microelectronics of Barcelona (IMB-CNM) explains why Europe is investing in the APECS Pilot Line and how advanced packaging and heterogeneous integration support the future of microelectronics. The video outlines the role of European semiconductor pilot lines under the EU Chips Act, the connection between manufacturing, design capabilities and competence centers, and how companies will be able to access advanced microelectronics technologies. IMB-CNM contributes to APECS in two areas: localized chip cooling through silicon microchannels and printed electronics for micrometer-scale antennas. These examples show how different technologies can be combined to create more functional and compact microelectronic systems. The video is part of APECS’ work to explain how European pilot lines, advanced packaging and heterogeneous integration can support access to next-generation microelectronics technologies. Copyright: CSIC Catalunya and the Institute of Microelectronics of Barcelona (IMB-CNM) Special thanks to the Institute of Microelectronics of Barcelona (IMB-CNM)for the production. More Information: https://www.apecs.eu/ Follow the APECS pilot line on LinkedIn: https://www.linkedin.com/company/apec...