Unveiling the Microstructure of Electronic and Semiconductor Materials

ZEISS experts discuss the characterization of microstructures in electronic and semiconductor materials, highlighting the importance of advanced imaging techniques in this recent webinar. 0:00 Introduction 08:05 Intro to Microscopy for Industry 13:22 Intro to AI in Microscopy 16:46 Microscopy in the Circular Economy 24:24 SEM/EDS of Copper Adhesive Tape 26:12 SEM/EDS of Thermal Gap Filler 27:04 Polyimide Films 30:07 Multi-Scale Imaging with X-ray Microscopy (XRM) 32:07 XRM Thermal Gap Fillers Part 1 33:12  AI vs FDK Reconstruction for XRM 35:00 XRM Thermal Gap Fillers Part 2 35:57 XRM of Polyester Films 40:45 Copper Clad Laminate Characterization 44:52 Image Analysis of CCL with arivis Cloud 47:56 Al Reconstruction for CCL 50:51 XRM of Elastomer Gaskets 51:37 Particle Connectivity in Elastomer Gaskets 52:27 Pores within Pores of Ag-Cu Particles ℹ️ 𝗠𝗼𝗿𝗲 𝗶𝗻𝗳𝗼𝗿𝗺𝗮𝘁𝗶𝗼𝗻: 🔬 Your Link: 🔬 More about our microscopy solutions: https://www.zeiss.com/microscopy/us/h... 💙 𝗦𝗼𝗰𝗶𝗮𝗹𝘀 Instagram:   / zeiss_microscopy   Linkedin:   / carl-zeiss-microscopy-gmbh   Facebook:   / zeissmicroscopy