Altium Designer Tutorial 44: How to Design a Reliable 0603 MLCC Footprint | IPC-7351
Altium 366
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Altium Designer Tutorial 44: How to Design a Reliable 0603 MLCC Footprint | IPC-7351
248 просмотров · 8 месяцев назад
Altium 366
887 подписчиков
248 просмотров · 8 месяцев назад
In this video, we explain 0603 MLCC footprint design using IPC-7351 guidelines, KEMET datasheets, and automotive acceptance considerations. You’ll learn how density levels, pad dimensions, and toe, heel, and side fillets affect solder joint reliability and PCB design decisions.
00:00 – Introduction 0603 MLCC Footprint Design & Standards
00:32 – Slide 1 : 0603 Capacitor: Imperial & Metric Conversion
01:33 – Slide 2 : 0603 Capacitor Physical Dimensions (Body & Terminal Dimensions – KEMET Datasheet)
03:17 – Slide 3 : 0603 Capacitor Land Pattern Dimensions (KEMET Recommended Pad Dimensions)
05:24 – Slide 4 : 0603 MLCC Pad Dimensions: Vendor vs IPC vs Automotive
08:36 – Slide 5 : 0603 MLCC Footprint Design Essentials (Key Parameters)
#PCBDesign #MLCC #IPC7351 #FootprintDesign #ElectronicsEngineering