InnoTherm Webinar #5: Get the Heat Out - Electronics Cooling from Smartphones to Data Centers

Heat removal poses design limits and adds parasitic power loads for electronics at all scales, from servers and laptops to electric vehicles. As information technology ramps up as a contributor to global energy consumption, electronics cooling is scaling up in environmental relevance and impact. This talk describes cooling innovations including fluidic heat sinks and spreaders containing thermal metamaterials, which combine thermal, mechanical, and fluidic properties not found in nature. These novel devices approach “thermal ground plane” performance for multi-kW converters and 3D logic. We’ve also recently made progress on thermal switch/regulator technologies, which promise better heat routing in power electronics and ASICs, using chalcogenide films, ion infusion within crystalline monolayer stacks, and capillary-driven fluidics. This webinar will highlight extensive design and prototyping with IC companies in Silicon Valley and beyond. Presenter: Ken Goodson, Stanford University Moderator: Dereje Agonafer, University of Texas at Arlington Questions from the Q&A: https://meche.mit.edu/sites/default/f... Learn more about the Innotherm webinars: https://meche.mit.edu/international-c...