Wafer-Level Photonics | Precision Testing & Alignment for Co-Packaged Optics

Wafer-level photonics is transforming the future of optical networks, but only when testing and alignment can keep pace. By integrating SEAT™ and MPC with GlobalFoundries’ silicon photonics process, fine mechanical alignment, detachability, and repeatable optical coupling are possible from wafer-level testing through packaged photonic engines. This approach enables earlier identification of known-good die, boosts manufacturing efficiency, and creates a practical path to scalable co-packaged optics. Take a closer look at how silicon photonics is being prepared for what’s next.