Summit Intel Chris по запросу V5

00:00:00 - Introduction to Backside Power and Transistor Innovations 00:00:21 - Welcome to Six Five Summit AI Unleashed 2026 00:01:09 - The Current State of Semiconductor Architecture 00:01:26 - The Shift from Traditional Scaling to System-Level Optimization 00:02:15 - Changing Definitions of Scaling in the Semiconductor Industry 00:04:15 - The Evolution of Compute Paradigms 00:05:34 - Gate All-Around Transistors and Backside Power Explained 00:07:55 - System-Level Design Considerations for AI and High Performance 00:09:15 - Future Breakthroughs in Semiconductor Performance 00:11:09 - Conclusion and Closing Remarks Chris Auth doesn't think scaling means what it used to. The Intel Foundry Vice President and General Manager of Manufacturing Development and Customer Engineering says the industry has moved from optimizing cost per transistor to optimizing value per transistor: performance, power efficiency, heat, and how a chip fits into a larger system, not just how small the process node gets. "...it's more of the value per transistor that starts to become important." — Chris Auth, Vice President and General Manager, Manufacturing Development and Customer Engineering, Intel Foundry At the Six Five Summit: AI Unleashed 2026, Ryan Shrout and Anshel Sag asked Auth what's driving that change. He points to two architecture shifts: Gate-All-Around transistors, which give the gate full control over the channel instead of the partial control FinFETs allowed, and backside power delivery, which moves power interconnects to the back of the chip so they can carry more current without crowding the signal lines on the front. Auth expects that combination, paired with rapid advances in hybrid bonding and 3D packaging, to serve as the foundation for chip architecture well into the next decade. Key Insights: 🔹 Scaling has shifted from cost per transistor to value per transistor, Auth says, meaning performance, power efficiency, thermals, and system-level fit now matter as much as raw process node size. 🔹 Gate-All-Around transistors give the gate full control over the channel, solving the partial-control limitation that capped how far FinFET transistors could scale. 🔹 Backside power delivery separates power and signal interconnects onto opposite sides of the chip, letting power wires run larger and lower-resistance without crowding signal lines. 🔹 AI's demand for inference is driving what Auth calls a resurgence of the CPU, since inference workloads need an orchestrator to manage memory and compute for each unique query, not just raw GPU throughput. 🔹 Auth expects no single breakthrough over the next five years. Instead: successive generations of Gate-All-Around transistors and backside power, layered with more advanced hybrid bonding and 3D packaging. Subscribe to our channel so you never miss an episode. Catch the rest of Six Five Summit: AI Unleashed 2026 coverage at https://www.sixfivemedia.com/summit #Intel #IntelFoundry #ChrisAuth #RyanShrout #AnshelSag #SixFiveSummit #AIUnleashed2026 #GateAllAround #BacksidePowerDelivery #FinFET #HybridBonding #SemiconductorPackaging #MooresLaw #AIAgent #AgenticAI #AIAgents #AIInfrastructure #EnterpriseAI #AIStocks #SemiconductorStocks Disclaimer: Six Five Media is for information and entertainment purposes only. Over the course of this video, we may discuss companies that are publicly traded, and we may reference their equity share prices. Nothing discussed during this webcast should be considered investment advice or a recommendation to buy or sell any security. We are not investment advisors, and you should not rely on this content as financial advice. Six Five Media collaborates with technology companies and industry leaders to produce research-driven interviews and multimedia programming for enterprise technology audiences.