Expert Session: Integrated Glass-Based Electro-Optical Platform for Co-Packaging

#2 Expert Session of Series »IZM Photonics: IN GLASS WE TRUST« Speaker: Oliver Kirsch, Fraunhofer IZM Latest trends in system integration and packaging are strongly aiming at heterogeneous, hybrid integration solutions such as co-packaging of electronics and optics and disaggregated system on-chip. In this webinar we will present a glass-based platform suitable for these integration strategies and show how our approach allows for a cost reduction compared to other material platforms (such as Si or SiN) as it is based on low-cost display glass which is available in large panel sizes (of up to 457 x 303 mm²) and commercial manufacturing equipment enabling high scalability. #photonics ​ #microelectronics ​ __________________ Official website: https://www.izm.fraunhofer.de/ Follow us on LinkedIn:   / 489228   Follow us on Twitter:   / fraunhofer_izm   Follow us on Instagram: https://www.instagram.com/fraunhofer_... Subscribe to our blog RealIZM: https://blog.izm.fraunhofer.de/