The Next Generation of Direct Writing

Heidelberg Instruments significantly extends its leadership in manufacturing of direct write lithography systems with the launch of the MLA Maskless Aligner series. Low to mid-volume lithography traditionally consists of creating designs with a CAD software, followed by fabricating or purchasing a photomask and finally using a mask aligner or stepper to transfer the pattern onto the photoresist. For high-volume manufacturing of sub-micron design nodes, this traditional process is required. However, for many other applications, such as designs with patterns of over one micron in a mid or low-volume production or prototyping environment, why not directly irradiate the wafer, forming the desired pattern and thereby getting rid of the mask aligner and the photomask process all together? At Heidelberg Instruments, we think you absolutely should, and therefore have introduced the MLA Maskless Aligner. No need for photomasks, mask aligners or steppers! Just create your design file and expose it directly on the wafer coated with resist. Find out more about the MLA 150: https://heidelberg-instruments.com/pr...