Calculation of Electronic Package Thermal Resistance with Ansys Icepak

Let's talk about thermal integrity for electronics systems. Ansys Icepak is a specialized software that predicts thermal field and cooling solutions for IC packages, printed circuit boards and complete electronics systems. Icepak also contains readily available macros to ease meshing, post-processing and even creating test beds. In this blog, we would like demonstrate a macro named "Extract JB and JC" that automatically builds and executes the JEDEC test environment to calculate IC package thermal resistances to case (Theta_JC) and board (Theta_JB). The following 8-minute video shows the full workflow to achieve this.