China's New 300mm Chip Megafactory That Terrifies TSMC!

China is building 300mm chip fabs, a secret EUV light source lab in Shenzhen, and a domestic lithography tool codenamed "Mount Everest." But does any of it actually terrify TSMC? In this video, I break down what's confirmed, what's only an estimate, and the one move from Washington that could change everything. 🔎 In this video: Why the 300mm wafer is China's entry ticket to compete with TSMC How Huawei and SMIC are building a full domestic chip supply chain SiCarrier: the little-known company building China's chipmaking tools The "Mount Everest" lithography tool and the Shenzhen EUV prototype SMIC's capacity ramp (45k → 80k wafers/month) vs TSMC Fab 15 Huawei's Ascend 950 target and SMIC's 93% utilization The HBM packaging bottleneck almost nobody talks about The US servicing restriction that could hit China's installed ASML machines ⚠️ Note: This video is based on public reporting from outlets such as Reuters and the Financial Times, plus industry analyst estimates. Several figures are estimates, not independently verified production numbers. This is not financial or investment advice. 👍 If you want China's chip race explained with the caveats included, subscribe for the follow-up when SMIC reports its next quarter. 💬 Comment below: which number decides this, the 93% utilization or the HBM packaging yield? #TSMC #SMIC #Huawei #ChipWar #Semiconductors #ASML #EUV #China #AI